METHOD FOR NANO POWDER LOADING INTO MICRO-CAPILLARY MOLD
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United States of America Patent
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Apr 2, 2020
app pub date -
Sep 28, 2018
filing date -
Sep 28, 2018
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Abstract
A method loading powder into a mold can include immersing the mold comprising one or more microchannels into a suspension comprising the powder and a surfactant suspended in a dispersant, wherein the powder comprises particles having an average particle size of less than 100 μm, wherein the mold is substantially entirely covered by the suspension; heating the suspension having the mold immersed therein under a temperature condition suitable to lower the stability of the particles of the powder in the suspension such that the particles settle out of solution and into the one or more microchannels; and applying an ultrasonic wave to the heated suspension to further settle the particles of the powder into the one or more microchannels thereby filling the one or more microchannels of the mold with the powder.
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