Vacuum assembly for chemical mechanical polishing

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United States of America Patent

PATENT NO 10843307
APP PUB NO 20200101580A1
SERIAL NO

16185723

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Abstract

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A method includes depositing a slurry onto a polishing pad of a chemical mechanical polishing (CMP) station. A workpiece is polished and polishing by-products and slurry are removed from the polishing pad by a vacuum head. A CMP apparatus includes a polishing pad configured to rotate during a CMP process. The apparatus also includes a slurry dispenser configured to deposit a slurry onto a polishing surface of the polishing pad. The apparatus further includes a momentum vacuum assembly including a slotted opening facing the polishing surface of the polishing pad. The apparatus also includes a first suction line coupled to an upper portion of the momentum vacuum assembly and leading to a first vacuum source, the first suction line configured to transport polishing products which have been removed from the polishing pad through the slotted opening.

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Patent Owner(s)

  • TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Chu, Chun-Jui Taoyuan, TW 6 8
Lai, Jen Chieh Tainan, TW 2 2
Lin, Shih-Ho Jhubei, TW 30 82
Wang, Szu-Cheng Tainan, TW 4 2
Wei, Yu-Chen New Taipei, TW 17 31
Yang, Chih-Yuan Hsinchu, TW 65 225

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