POLY(AMIC ACID), POLY(AMIC ACID) SOLUTION, POLYIMIDE, POLYIMIDE FILM, LAYERED PRODUCT, FLEXIBLE DEVICE, AND PRODUCTION METHOD FOR POLYIMIDE FILM

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United States of America Patent

APP PUB NO 20200102423A1
SERIAL NO

16611496

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Abstract

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A polyamic acid that has a fluorine atom content of 25 wt % or less and an amount of a fluorine-containing diamine in the polyamic acid is 70 mol % or more with respect to 100 mol % of a sum of diamine components. The total number of moles of tetracarboxylic acid component in the polyamic acid is 0.960 times or more and less than 1.000 time total number of moles of diamine component. The polyamic acid preferably has the structural unit represented by formula (1) and the structural unit represented by formula (2). The polyamic acid may contain trans-1,4-cyclohexanediamine as the diamine component.

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Patent Owner(s)

Patent OwnerAddress
KANEKA CORPORATION2-3-18 NAKANOSHIMA KITA-KU OSAKA-SHI OSAKA 530-8288

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
NAKAYAMA, Hirofumi Otsu-shi, JP 9 122
UNO, Mari Otsu-shi, JP 8 12

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