Two-phase metallic alloys to facilitate thermal energy storage of a system on chip

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United States of America Patent

PATENT NO 11378346
APP PUB NO 20200103177A1
SERIAL NO

16147548

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Abstract

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Embodiments herein relate to systems, apparatuses, processing, and techniques related to patterning one or more sides of a thin film capacitor (TFC) sheet, where the TFC sheet has a first side and a second side opposite the first side. The first side and the second side of the TFC sheet are metal and are separated by a dielectric layer, and the patterned TFC sheet is to provide at least one of a capacitor or a routing feature on a first side of a substrate that has the first side and a second side opposite the first side.

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Patent Owner(s)

  • INTEL CORP.

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Chang, Je-Young Phoenix, US 63 342

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