Semiconductor packages, storage devices including the same, and method of operating the semiconductor packages

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 10692543
APP PUB NO 20200105308A1
SERIAL NO

16363307

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Abstract

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A semiconductor package includes first through third memory chips. The first memory chip is arranged on a package substrate, the second memory chip is arranged on the first memory chip, and the third memory chip is arranged between the first memory chip and the second memory chip. Each of the first through third memory chips includes a memory cell array storing data, stress detectors, a stress index generator, and a control circuit. The stress detectors are formed and distributed in a substrate, and detect stacking stress in response to an external voltage to output a plurality of sensing currents. The stress index generator converts the plurality of sensing currents into stress index codes. The control circuit adjusts a value of a feature parameter associated with an operating voltage of a corresponding memory chip, based on at least a portion of the stress index codes.

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Patent Owner(s)

Patent OwnerAddress
SAMSUNG ELECTRONICS CO LTDGYEONGGI DO SOUTH KOREA GYEONGGI-DO

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Byeon, Dae-Seok Seongnam-si, KR 109 1399
Min, Young-Sun Hwaseong-si, KR 29 114
Na, Young-Ho Seoul, KR 2 1

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