Compact semiconductor chip system and method

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United States of America Patent

PATENT NO 11096284
APP PUB NO 20200107444A1
SERIAL NO

16451542

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Abstract

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A semiconductor device and associated methods are disclosed. In one example, a processor die is coupled to a first side of a package substrate, and a memory die coupled to a second side of the package substrate. A system accelerator die is further coupled to the package substrate. In selected examples, the system accelerator die provides performance improvements, such as higher cached memory speed and/or higher memory bandwidth.

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Patent Owner(s)

  • INTEL CORP.

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Chang, Mooi Ling Bayan Baru, MY 12 54
Hoe, Wee Bayan Lepas, MY 6 19
Lee, Chan Kim Bayan Lepas, MY 9 35
Tan, Say Thong Tony Island Park, MY 2 0
Tan, Siang Yeong Bayan Lepas, MY 5 14
Yee, Chee Chun Bayan Lepas, MY 8 24

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