ETCHING METHOD
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United States of America Patent
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Issued Date -
Apr 9, 2020
app pub date -
Dec 9, 2019
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Feb 12, 2015
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Abstract
An etching method is capable of etching titanium selectively in the presence of copper. An etching liquid used in the method is low in toxicity and excellent in storage stability. The etching liquid includes at least one acid, such as, sulfuric acid, hydrochloric acid, or trichloroacetic acid, and at least one organic sulfur compound, such as a thioketone compound or a thioether compound.
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