METHOD OF MANUFACTURING SPUTTERING TARGET AND SPUTTERING TARGET

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United States of America Patent

APP PUB NO 20200115791A1
SERIAL NO

16713978

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Abstract

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The manufacturing cost of a sputtering target is reduced and the impurity concentration of the manufactured sputtering target is also reduced. A method of manufacturing a sputtering target includes: surface-treating at least one of a used sputtering target and a scrap material; melting at least one of the used sputtering target and the scrap material after the surface treatment to form an ingot; and manufacturing a sputtering target by subjecting the ingot to forging, rolling, heat treating, and machining.

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Patent Owner(s)

Patent OwnerAddress
KABUSHIKI KAISHA TOSHIBA1-1 SHIBAURA 1-CHOME MINATO-KU TOKYO 105-0023

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
KOMATSU, Tooru Yokosuka, JP 3 0
NAKASHIMA, Nobuaki Yokohama, JP 18 54

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