Method for manufacturing aluminum circuit board

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United States of America Patent

PATENT NO 11570901
APP PUB NO 20200120809A1
SERIAL NO

16488776

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Abstract

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A method for manufacturing an aluminum circuit board including a step of spraying a heated metal powder containing aluminum particles and/or aluminum alloy particles to a ceramic base material, and of forming a metal layer on a surface of the ceramic base material. A temperature of at least a part of the metal powder is higher than or equal to a softening temperature of the metal powder and lower than or equal to a melting point of the metal powder at a time point of reaching the surface of the ceramic base material. A velocity of at least a part of the metal powder is greater than or equal to 450 m/s and less than or equal to 1000 m/s at the time point of reaching the surface of the ceramic base material.

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Patent Owner(s)

Patent OwnerAddress
NATIONAL INSTITUTE FOR MATERIALS SCIENCE2-1 SENGEN 1-CHOME TSUKUBA-SHI IBARAKI 3050047 ?3050047
DENKA COMPANY LIMITED1-1 NIHONBASHI-MUROMACHI 2-CHOME CHUO-KU TOKYO 103-8338

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Araki, Hiroshi Tsukuba, JP 113 1255
Hasegawa, Akira Tsukuba, JP 303 4645
Kuroda, Seiji Tsukuba, JP 35 743
Sakai, Atsushi Omuta, JP 184 1278
Taniguchi, Yoshitaka Omuta, JP 20 55
Watanabe, Makoto Tsukuba, JP 386 3408
Yamada, Suzuya Tokyo, JP 17 55

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