Resin composition, prepreg, resin sheet, metal foil-clad laminate, and printed circuit board

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United States of America Patent

PATENT NO 11195638
APP PUB NO 20200152349A1
SERIAL NO

16744625

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Abstract

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A resin composition that includes a maleimide compound, an alkenyl-substituted nadimide, a silane compound having a styrene skeleton and a hydrolyzable group or a hydroxy group, and an inorganic filler.

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Patent Owner(s)

Patent OwnerAddress
MITSUBISHI GAS CHEMICAL COMPANY INCCHIYODA-KU TOKYO 100-8324

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Ito, Meguru Tokyo, JP 14 37
Shiga, Eisuke Tokyo, JP 23 69
Takano, Yoichi Tokyo, JP 51 214
Tomizawa, Katsuya Tokyo, JP 17 26

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