Thermally conductive member and method for producing thermally conductive member
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Sep 22, 2020
Grant Date -
May 28, 2020
app pub date -
Jan 27, 2017
filing date -
Feb 5, 2016
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
Provided is a thermally conductive member having excellent thermal resistance and insulating properties.The thermally conductive member includes a silicone resin, a thermally conductive filler having a larger particle diameter from 30 um to 100 μm, a thermally conductive filler having a smaller particle diameter of not greater than 10 um, and mica having a particle diameter of not greater than 10 um and an aspect ratio of not greater than 50. The mica is added at a ratio of from 0.9 to 11 parts by mass relative to 100 parts by mass of the silicone resin.
First Claim
Family
International Classification(s)
- [Classification Symbol]
- [Patents Count]
Cited Art Landscape
Patent Citation Ranking
Advertisement
Advertisement
Advertisement
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully