METHOD FOR FORMING CIRCUIT PATTERN ON SURFACE OF THREE-DIMENSIONAL STRUCTURE
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
N/A
Issued Date -
Jun 4, 2020
app pub date -
Nov 27, 2019
filing date -
Dec 4, 2018
priority date (Note) -
Published
status (Latency Note)
Importance
Abstract
A method for forming a circuit pattern on a surface of a 3D structure includes: forming a first insulation layer on the surface of the 3D structure; forming a conductive pattern on the first insulation layer; forming a second insulation layer on the conductive pattern except for a circuit element mounting region; and mounting one or more circuit elements on the circuit element mounting region.
First Claim
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Advertisement
Advertisement
Advertisement
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully