Wafer scale ultrasonic sensor assembly and method for manufacturing the same

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United States of America Patent

PATENT NO 11460341
APP PUB NO 20200191646A1
SERIAL NO

16429801

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Abstract

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A wafer scale ultrasonic sensor assembly includes a wafer substrate, an ultrasonic element, first and second protective layers, conductive wires, a transmitting material, an ASIC, a conductive bump, and a soldering portion. The wafer substrate includes a via. The ultrasonic element is exposed to the via. The conductive wires are on the first protective layer and connected to the ultrasonic element. The second protective layer covers the conductive wires, and the second protective layer has an opening corresponding to the ultrasonic element. The transmitting material contacts the ultrasonic element. The ASIC is connected to the wafer substrate, so that the via forms a space between the ASIC and the ultrasonic element. The conductive pillar is in a via defined through the ASIC, the wafer substrate, and the first protective layer, and the conducive pillar is respectively connected to the conductive wires and the soldering portion.

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Patent Owner(s)

Patent OwnerAddress
SONICMEMS (ZHENGZHOU) TECHNOLOGY CO LTDROOM 301 BUILDING 5 NO 32 WUTONG STREET ZHENGZHOU HI-TECH INDUSTRIAL DEVELOPMENT ZONE ZHENGZHOU 450001

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Chiu, Yi-Hsiang Taipei, TW 20 31
Gong, Dan Shenzhen, CN 8 15
Jin, Yu-Feng Shenzhen, CN 6 16
Lee, Hung-Ping Taipei, TW 12 36
Ma, Sheng-Lin Shenzhen, CN 7 16

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