ADDITIVE FOR IMPARTING LOW HEAT BUILD-UP TO RUBBER COMPONENT

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United States of America Patent

APP PUB NO 20200231782A1
SERIAL NO

16812124

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Abstract

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Provided is an additive for imparting low heat build-up to a rubber component, wherein the additive includes a tetrazine compound represented by general formula (1):

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Patent Owner(s)

Patent OwnerAddress
OTSUKA CHEMICAL CO LTDOSAKA JAPAN OSAKA

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
NAKASHIMA, Shinya Tokushima-shi, JP 36 98
SATO, Takashi Tokushima-shi, JP 973 9680
YUASA, Hiroaki Tokushima-shi, JP 69 310

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