Circuit board interconnect decals
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United States of America Patent
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-
Aug 11, 2020
Grant Date -
Jul 23, 2020
app pub date -
Dec 27, 2019
filing date -
Jan 22, 2019
priority date (Note) -
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status (Latency Note)
Importance
Abstract
A circuit component decal comprising a transparent sheet and an opaque circuit pattern. The transparent sheet includes opposing top and bottom surfaces and a number of edges. The opaque circuit pattern includes an electronic component footprint and a number of circuit lead paths. The electronic component footprint includes a number of contact points representing the location of leads of the electronic component. The circuit lead paths extend from the contact points to the edges of the transparent sheet. The opaque circuit pattern corresponds to only a section of a complete circuit pattern and is configured to block energy from reaching a first portion of the intermediate substrate when the transparent sheet is positioned on the intermediate substrate so as to form the section of the complete circuit pattern.
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