PACKAGE OF LAMINATIONS, MANUFACTURING METHOD, MULTI-PLATE COUPLING AND INDUSTRIAL APPLICATION
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United States of America Patent
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Issued Date -
Oct 8, 2020
app pub date -
Apr 2, 2020
filing date -
Apr 3, 2019
priority date (Note) -
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Abstract
A package of laminations includes a plurality of lamella segments, which are arranged in layers and embodied to be connected together as ring segments. Each of the lamella segments has a plurality of cutouts and at least one of the lamella segments has at least three cutouts. The lamella segments are interconnected via sleeves. A method for manufacturing a package of laminations, a multi-plate coupling employing the package of laminations and an industrial application using the disclosed type of coupling are also described.
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