Chip resistor
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United States of America Patent
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Mar 30, 2021
Grant Date -
Oct 29, 2020
app pub date -
Jul 10, 2018
filing date -
Jul 19, 2017
priority date (Note) -
Published
status (Latency Note)
Importance
Abstract
The chip resistor according to the present disclosure includes insulating substrate, a pair of upper face electrodes provided on both ends of one face of insulating substrate, and resistor provided on the one face of insulating substrate and connected between the pair of upper face electrodes. The chip resistor includes a pair of end-face electrodes provided on both end faces of insulating substrate to be electrically connected to the pair of upper face electrodes, and plating layer formed on portions of the pair of upper face electrodes and faces of the pair of end-face electrodes. Insulating film formed of a resin is provided on another face opposite to the one face of insulating substrate. Insulating film has a thickness of more than or equal to 30 μm.
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