In Situ Process Chamber Chuck Cleaning by Cleaning Substrate
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United States of America Patent
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Issued Date -
Dec 10, 2020
app pub date -
Nov 13, 2019
filing date -
Jun 10, 2019
priority date (Note) -
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Abstract
A cleaning assembly is disclosed. The cleaning assembly includes a substrate. One or more patterns are formed on a bottom side of the substrate. One or more structures within the one or more patterns attract one or more particles from a chuck via at least one of electrostatic attraction or mechanical trapping when the substrate is positioned on the chuck.
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