COMPOUND POWDER
Number of patents in Portfolio can not be more than 2000
United States of America Patent
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Issued Date -
Dec 17, 2020
app pub date -
Feb 28, 2018
filing date -
Feb 28, 2018
priority date (Note) -
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Abstract
Provided is a compound powder suitable for producing a molded body having a high density. A compound powder 10 includes metal element-containing particles 1 and a resin composition 2 covering the metal element-containing particle 1, in which a melt viscosity of the resin composition 2 at 100° C. is 0.01 Pa·s or more and 10 Pa·s or less.
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