OXIDATION-RESISTANT CONDUCTIVE COPPER PASTE, METHOD FOR PREPARATION THEREOF AND METHOD FOR MANUFACTURING CONDUCTIVE FILM
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United States of America Patent
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Issued Date -
Dec 31, 2020
app pub date -
Jan 22, 2020
filing date -
Jun 25, 2019
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Abstract
The present invention discloses an oxidation-resistant conductive copper past, a manufacturing method and a use thereof. The oxidation-resistant conductive copper paste comprises 70 wt % to 90 wt % of copper particles, a binder, a thixotropic agent and a solvent. The manufacturing method comprises the steps of mixing the binder, the thixotropic agent and ethanol thoroughly to obtain a first mixture; mixing the solvent with the first mixture thoroughly to obtain a second mixture; mixing the copper particles with the second mixture to obtain a conductive copper paste precursor; and removing the ethanol from the conductive copper paste precursor to obtain the oxidation-resistant conductive copper paste. The oxidation-resistant conductive copper paste can be used for manufacturing a conductive film of a circuit board or an electrode of a solar battery by a printing process.
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