Method of Manufacturing an Electronic Control Device
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United States of America Patent
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Issued Date -
Feb 11, 2021
app pub date -
May 13, 2019
filing date -
May 14, 2018
priority date (Note) -
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Abstract
Provided is a method of manufacturing an electronic control device. The method includes: providing a housing body with a first part and a second part; providing a multilayer assembly having a first pressure sensitive adhesive polymeric layer of a first pressure sensitive adhesive composition adjacent to a second pressure sensitive adhesive polymeric foam layer of a second pressure sensitive adhesive composition; wherein the second pressure sensitive adhesive composition includes: a polymer base material selected from the group consisting of polyacrylates, polyurethanes, polyolefins, polyamines, polyamides, polyesters, polyethers, polyisobutylene, polystyrenes, polyvinyls, polyvinylpyrrolidone, natural rubbers, synthetic rubbers, and any combinations, copolymers or mixtures thereof; adhering the first pressure sensitive adhesive polymeric layer to the first part; and adhering the second part to the second pressure sensitive adhesive polymeric foam layer.
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