MULTI-LAYERED ANISOTROPIC CONDUCTIVE ADHESIVE HAVING CONDUCTIVE FABRIC AND PREPARATION THEREOF
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United States of America Patent
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Issued Date -
Feb 11, 2021
app pub date -
Sep 28, 2020
filing date -
Mar 27, 2017
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Abstract
Provided is a multi-layered anisotropic conductive adhesive including an upper conductive adhesive layer, a conductive fabric layer with two sides and a lower conductive adhesive layer, wherein one side of the conductive fabric layer is plated with metal. In the application of a flexible printed circuit, reinforced parts, formed by laminating multi-layered anisotropic conductive adhesive with steel or polyimide-type stiffener, can effectively prevent the deformation of installed parts due to warping, and ensure the good hole filling, good direct grounding effect, and good shielding performance Therefore, the multi-layered anisotropic conductive adhesive has good electrical properties, good adhesive strength, better tin soldering, reliability and flame resistant. Also provided is a method of producing the multi-layered anisotropic conductive adhesive.
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