C-CONTAINING SPUTTERING TARGET AND METHOD FOR PRODUCING SAME

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United States of America Patent

APP PUB NO 20210040602A1
SERIAL NO

17044687

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Abstract

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A sputtering target with suppressed aggregation of C particles and reduced generation of particles is provided.

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Patent Owner(s)

Patent OwnerAddress
TANAKA KIKINZOKU KOGYO K KCHIYODA-KU TOKYO 100-6422

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Kobayashi, Hironori Ibaraki, JP 183 1374
Kurose, Kenta Ibaraki, JP 4 0
Miyashita, Takanobu Ibaraki, JP 17 33
Nakano, Masahumi Ibaraki, JP 2 28
Nishiura, Masahiro Ibaraki, JP 21 165
Yamamoto, Takamichi Ibaraki, JP 12 9

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