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• 15 United States
• 10 France
• 8 Japan
• 7 China
• 5 Korea
• 2 Other

Patent Owner(s)

Patent Owner	Address
SEONGNAM-SI GYEONGGI-DO	34 PANGYO-RO 255BEON-GIL BUNDANG-GU SEONGNAM-SI GYEONGGI-DO 13486

International Classification(s)

• H01L:SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICE....
• C09G:POLISHING COMPOSITIONS OTHER THAN FRENCH POLISH; S....

• [Classification Symbol]

• [Patents Count]

Inventor(s)

Inventor Name	Address	# of filed Patents	Total Citations
Lee, Jin-Uk	Seongnam-si, KR	31	175
Lim, Jung-Hun	Seongnam-si, KR	16	67
Park, Jae-Wan	Seongnam-si, KR	33	208

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Maintenance Fees

Fee	Large entity fee	small entity fee	micro entity fee	due date
3.5 Year Payment	$1600.00	$800.00	$400.00	Feb 16, 2026
7.5 Year Payment	$3600.00	$1800.00	$900.00	Feb 16, 2030
11.5 Year Payment	$7400.00	$3700.00	$1850.00	Feb 16, 2034

Fee	Large entity fee	small entity fee	micro entity fee
Surcharge - 3.5 year - Late payment within 6 months	$160.00	$80.00	$40.00
Surcharge - 7.5 year - Late payment within 6 months	$160.00	$80.00	$40.00
Surcharge - 11.5 year - Late payment within 6 months	$160.00	$80.00	$40.00
Surcharge after expiration - Late payment is unavoidable	$700.00	$350.00	$175.00
Surcharge after expiration - Late payment is unintentional	$1,640.00	$820.00	$410.00

DATE PUBLISHED	PUBLICATION/PATENT NO.	PUBLICATION TYPE
August 16, 2022	US,11414569,B2   US11414569B2	GRANTED PATENT AS SECOND PUBLICATION
February 25, 2021	US,20210054237,A1   US20210054237A1	FIRST PUBLISHED PATENT APPLICATION

Full Text

US Patent Application No: 2021/0054,237

COMPOSITION FOR ETCHING AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE USING THE SAME

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