Importance

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Abstract

Package 1a has ceramic substrate body 2 having front and back surfaces 3, 4 and side surface 5 between these surfaces, cavity 6 opening on front surface 3 and having bottom surface 7 and inner side surface 8, electrode pad 9 formed on bottom surface 7, external connecting terminal 10 formed on back surface 4, electronic component 14 mounted on electrode pad 9 and electrolyte 16 filling cavity 6. Electrode pad 9 and external connecting terminal 10 are electrically connected to each other through via conductor 12 penetrating ceramic layer c1 forming bottom surface 7 of cavity 6 and back surface 4 of substrate body 2. Side surface conductor 17 is provided on side surface 5 of substrate body 2, and side surface conductor 17 and external connecting terminal 10 are connected to each other. Electrode pad 9 and side surface conductor 17 are separate from each other.

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First Claim