Substrate processing apparatus, film formation unit, substrate processing method and film formation method
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United States of America Patent
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May 21, 2024
Grant Date -
Mar 18, 2021
app pub date -
Nov 6, 2020
filing date -
Jun 3, 2015
priority date (Note) -
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Abstract
A coating liquid containing metal as a metal-containing coating liquid is supplied to a surface to be processed of a substrate by a coating processing unit, whereby a metal-containing coating film is formed on the surface to be processed. The substrate on which the metal-containing coating film has been formed is transported to a metal removal unit by a transport mechanism. A removal liquid for dissolving the metal is supplied to a peripheral portion of the substrate by the metal removal unit such that the metal-containing coating film remains in a region except for the peripheral portion of the surface to be processed of the substrate.
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