METAL PARTICLE
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United States of America Patent
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Issued Date -
Mar 18, 2021
app pub date -
Sep 16, 2019
filing date -
Sep 16, 2019
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Abstract
Disclosed is a metal particle that includes Cu and Sn, the metal particle having a metal matrix composed of Sn—Cu alloy, and a nano-sized intermetallic compound composed of Cu and Sn, and the metal particle having at least inside thereof an alloyed structure in which the metal matrix and the intermetallic compound form an endotaxial junction.
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