MULTI-STEP AGING PROCESS FOR IMPROVED BOND DURABILITY
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United States of America Patent
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Mar 18, 2021
app pub date -
Sep 17, 2019
filing date -
Sep 17, 2019
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Abstract
A method of treating an aluminum material to increase adhesive bond durability is disclosed. The disclosed method includes a first aging step of heating an aluminum component to a first temperature no more than 150° C. (302° F.) for a first time period followed by a second aging step including heating the aluminum component to a second temperature greater than the first temperature for a second time period.
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