SUBSTRATE TREATING APPARATUS

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United States of America Patent

APP PUB NO 20210082721A1
SERIAL NO

17102615

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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A substrate treating apparatus includes a plurality of solution treating units for performing solution treatment of substrates, and a plurality of individual gas supply devices provided to correspond individually to the solution treating units, each for supplying gas at a variable rate only to one of the solution treating units. The solution treating units perform the solution treatment by supplying treating solutions to the substrates. The individual gas supply devices supply gas only to the solution treating units corresponding thereto. The individual gas supply devices supply the gas at adjustable rates to the solution treating units. The rate of gas supply to the solution treating units can therefore be varied for each solution treating unit.

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Patent Owner(s)

Patent OwnerAddress
SCREEN HOLDINGS CO LTDKYOTO

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
MAEDA, Masafumi Kyoto-shi, JP 43 483

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