Double-Sided, Single Conductor Laminated Substrate
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United States of America Patent
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Issued Date -
Mar 25, 2021
app pub date -
Mar 18, 2020
filing date -
Sep 24, 2019
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Abstract
A method for manufacturing a double-sided, single conductor laminate includes providing a laminated substrate that includes a conductive layer, an adhesive layer and a support layer; dry milling a trace pattern in the laminated substrate by removing selected areas of the conductive layer and the adhesive layer; and attaching a first cover layer using a first adhesive layer to the conductive layer. The first cover layer includes one or more precut access holes that align with one or more traces of the trace pattern.
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