ETCHING COMPOSITIONS
Number of patents in Portfolio can not be more than 2000
United States of America
Stats
-
N/A
Issued Date -
N/A
app pub date -
Nov 24, 2020
filing date -
Nov 24, 2020
priority date (Note) -
Published
status (Latency Note)
Importance
Loading Importance Indicators... 
Abstract
The present disclosure is directed to etching compositions that are useful, e.g., for selectively removing tungsten (W) and/or titanium nitride (TiN) from a semiconductor substrate as an intermediate step in a multistep semiconductor manufacturing process.
Loading the Abstract Image...
OK
First Claim
Family
Loading Family data...
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Advertisement
Advertisement
Advertisement
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully