Capacitor and Electronics Module Assembly with Low-Inductance Connection Features

Number of patents in Portfolio can not be more than 2000

United States of America

APP PUB NO 20210118613A1
SERIAL NO

16654622

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Abstract

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A capacitor includes an electrically insulating housing that encloses an interior volume, first and second conductive connection pads that are each configured as externally accessible points of electrical contact to internal electrodes of the capacitor that are disposed within the housing, and an active capacitor dielectric material disposed within the housing and being configured as a dielectric medium between the internal electrodes, the first conductive connection pad having a first planar contact surface that is substantially parallel to a first sidewall of the housing, the second conductive connection pad having a second planar contact surface that is substantially parallel to the first sidewall, the first and second planar contact surfaces being offset from one another in a direction that is orthogonal to the first sidewall.

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Patent Owner(s)

Patent OwnerAddress
TDK ELECTRONICS AG81671 MÜNCHEN

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Niklas, Karl Itzelberg, DE 6 46
Reiter, Tomas Manuel Munich, DE 20 42

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