SIZING APPARATUS, AND METHOD FOR MANUFACTURING SINTERED BODY

Number of patents in Portfolio can not be more than 2000

United States of America

APP PUB NO 20210129219A1
SERIAL NO

16640096

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ATTORNEY / AGENT: (SPONSORED)

Importance

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Abstract

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Provided is a sizing apparatus including: a die set including a die plate that holds a die provided with a through hole to which a workpiece is to be supplied, and upper and lower punches that are to be inserted into the through hole to press the workpiece; a press main body that includes punch driving mechanisms that actuate the punches and in which the die set is configured to be attached to and detached from a predetermined position; and a turntable that is rotated on the die plate and supplies a workpiece to the die and discharges a workpiece from the die. The die set includes the turntable, and a supporting base on which the turntable is placed. The supporting base includes an axis positioning portion that is provided coaxially with a central axis of the turntable and positions the central axis at a predetermined position of the supporting base.

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Patent Owner(s)

Patent OwnerAddress
SUMITOMO ELECTRIC SINTERED ALLOY LTDNO 2901 OZAA-NARIWA NARIWA-CHO KAWAKAMI-GUN OKAYAMA

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
HAYASHI, Shinji Takahashi-shi, Okayama, JP 95 654
TAKEUCHI, Kenji Takahashi-shi, Okayama, JP 121 598

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