RESISTOR AND CIRCUIT SUBSTRATE
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United States of America Patent
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Issued Date -
Jul 22, 2021
app pub date -
Jun 21, 2019
filing date -
Jul 12, 2018
priority date (Note) -
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Abstract
A resistor according to the present disclosure includes an insulated substrate, a resistive layer formed of a resistance body material and a bonding layer for bonding the insulated substrate and the resistive layer, wherein the resistor is configured so that a ratio of a sheet resistance of the bonding layer to a sheet resistance of the resistive layer is 100 or more.
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