ELECTRICALLY CONDUCTIVE PASTE FOR FORMING PILLARS
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United States of America Patent
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Issued Date -
Jul 29, 2021
app pub date -
Apr 25, 2019
filing date -
Jun 27, 2018
priority date (Note) -
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Abstract
The known electrolytic plating method is disadvantageous in that it is difficult to form thin pillars without being influenced by undercuts. The electroless plating method is disadvantageous in that it is difficult to form pillars in the same shape without voids. As a solution to these, the electrically conductive paste according to the present invention for forming pillars is used to make pillars by filling. This helps prevent undercuts, and it is also intended to provide metal pillars in the same shape with good reproducibility. The inventors found that an electrically conductive paste that is very small fine metal particles and contains a particular percentage of fine metal particles is extraordinarily advantageous in forming pillars.
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