CORROSION INHIBITION SYSTEM PRIMERS AND ADHESIVES FOR METAL BOND STRUCTURES
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United States of America Patent
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Oct 7, 2021
app pub date -
Mar 11, 2021
filing date -
Apr 7, 2020
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Abstract
A method of forming an adhesively bonded structure may comprise applying a primer compound to a first substrate, wherein the primer compound comprises a functionalized nanomaterial dopant, drying the primer compound on the substrate to form a primer layer comprising the functionalized nanomaterial dopant, applying an adhesive compound over the primer layer to form an adhesive layer, wherein the adhesive compound comprises the functionalized nanomaterial dopant, contacting the adhesive layer with a second substrate and curing the adhesive layer to form an adhesively bonded structure, wherein the first substrate is metallic and the second substrate is at least one of metallic or composite.
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