MASK, MASK ASSEMBLY, AND METHOD FOR MANUFACTURING THE MASK
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United States of America Patent
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Issued Date -
Oct 21, 2021
app pub date -
Nov 1, 2018
filing date -
May 14, 2018
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Abstract
The present disclosure relates to masks, mask assemblies, and methods for manufacturing masks. The mask is configured to be tensioned and soldered on a support frame. The mask is an electroformed mask. The mask includes an evaporation area, a non-evaporation area, and a soldering area used to be soldered to the support frame. At least the soldering area is doped with magnetic metal ions, thereby improving soldering performance of the soldering area.
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