ETCHING SOLUTION, ANNEXING AGENT, AND MANUFACTURING METHOD OF METAL WIRING

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United States of America

APP PUB NO 20210404068A1
SERIAL NO

16652286

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Abstract

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An etching solution, an annexing agent, and a manufacturing method of a metal wiring are disclosed. A main ingredient of the etching solution includes hydrogen peroxide accounting for 5% to 30% of a total weight of the etching solution, a hydrogen peroxide stabilizer accounting for 0.1% to 5% of the total weight of the etching solution, a chelant accounting for 5% to 25% of the total weight of the etching solution, a surface active agent accounting for 0.1% to 1% of the total weight of the etching solution, an inorganic acid oxidant accounting for 0.1% to 5% of the total weight of the etching solution, and a remainder of the etching solution is deionized water. The annexing agent is added to the etching solution when the etching solution is used repeatedly.

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Patent Owner(s)

Patent OwnerAddress
TCL CHINA STAR OPTOELECTRONICS TECH CO LTDNot Provided

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
WU, Haoxu Shenzhen, Guangdong, CN 5 0
ZHANG, Yuehong Shenzhen, Guangdong, CN 6 1

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