POLISHING LIQUID
Number of patents in Portfolio can not be more than 2000
United States of America
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Issued Date -
Feb 3, 2022
app pub date -
Jul 21, 2021
filing date -
Jul 21, 2021
priority date (Note) -
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Abstract
Provided is a polishing liquid that is used when one surface of a wafer is polished by use of a fixed abrasive grain polishing pad with abrasive grains fixed in the pad, in which an organic salt that exhibits a basic property by hydrolysis and contains no metal and an organic base that contains no metal are dissolved, and no abrasive grains are contained. Preferably, the organic salt includes a strong basic cation and a weak acidic anion, and the organic base contains at least one of ammonia, an amine, and a basic amino acid.
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