Sputtering Target and Method for Producing Same

Number of patents in Portfolio can not be more than 2000

United States of America

APP PUB NO 20220033960A1
SERIAL NO

17279092

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Abstract

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Provided is a cylindrical sputtering target made of a metal material, which has reduced particles. The sputtering target includes at least a target material, wherein the target material comprises one or more metal elements, the target material has a crystal grain size of 50 μm or less, and the target material has an oxygen concentration of 1000 ppm by mass or less.

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Patent Owner(s)

Patent OwnerAddress
JX ADVANCED METALS CORPORATIONTOKYO 105-8417

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Murata, Shuhei Ibaraki, JP 24 190
Okabe, Takeo Ibaraki, JP 37 308
Shono, Daiki Ibaraki, JP 6 0

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