PARTICLES FOR JOINING MATERIAL AND PRODUCTION METHOD THEREOF, JOINING PASTE AND PREPARATION METHOD THEREOF, AND PRODUCTION METHOD OF JOINED BODY

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United States of America Patent

APP PUB NO 20220040759A1
SERIAL NO

17281344

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Abstract

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Particles for joining material are such that an organic protective film is formed on the surface of copper nanoparticles, and have a BET specific surface area in a range of 3.5 m2/g to 8 m2/g, and a BET diameter in a range of 80 nm to 200 nm, wherein the organic protective film is included in a range of 0.5% to 2.0% by mass with respect to the particles for joining material. When the particles for joining material are analyzed by using the Time-Of-Flight Secondary Ion Mass Spectrometry (TOF-SIMS) method, respective detected amounts of C3H3O3 ions and C3H4O2 ions are in a range of 0.05 times to 0.2 times a detected amount of Cu+ ions, and a detected amount of ions of C5 or more is in a range less than 0.005 times the detected amount of Cu+ ions.

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Patent Owner(s)

Patent OwnerAddress
MITSUBISHI MATERIALS CORPORATION2-3 MARUNOUCHI 3-CHOME CHIYODA-KU TOKYO 100-8117

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Higami, Akihiro Naka-shi, JP 6 72
Otogawa, Kohei Naka-shi, JP 6 0
Yamaguchi, Tomohiko Naka-shi, JP 18 155

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