METHOD FOR MANUFACTURING SILICON CARBIDE EPITAXIAL SUBSTRATE

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United States of America Patent

APP PUB NO 20220044934A1
SERIAL NO

17276338

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In a step of calculating formation conditions for the second silicon carbide layer, a formation time of the second silicon carbide layer is calculated as a value obtained by multiplying a value obtained by dividing the second thickness by the first thickness, by the first formation time, and a flow rate of a second ammonia gas in a step of forming the second silicon carbide layer by epitaxial growth is calculated as a value obtained by multiplying a value obtained by dividing the second concentration by the first concentration, by the first flow rate.

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Patent OwnerAddress
SUMITOMO ELECTRIC INDUSTRIES LTD5-33 KITAHAMA 4-CHOME CHUO-KU OSAKA-SHI OSAKA 541-0041

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Inventor Name Address # of filed Patents Total Citations
ITOH, Hironori Osaka, JP 19 94

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