METAL BOND GRINDSTONE FOR HARD AND BRITTLE MATERIAL

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United States of America Patent

APP PUB NO 20220048161A1
SERIAL NO

17425889

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Abstract

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A metal bond grindstone grinds a hard and brittle material. The metal bond grindstone includes: a metal bond; abrasive grains bound by the metal bond; and pores having a pore size of 50-200 μm, such that a porosity in an entirety of the metal bond grindstone is 50-65 vol %. A number of the abrasive grains on a grinding surface excluding the pores may be 700-6500 grains/cm2. The abrasive grains may be diamond abrasive grains, and a grain size of the abrasive grains may be 4-20 μm in median size. The metal bond grindstone may have a grindstone strength of 40-95 MPa.

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Patent Owner(s)

Patent OwnerAddress
NORITAKE CO LIMITEDNISHI-KU NAGOYA-SHI AICHI 451-8501

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
FURUNO, Daiki Nagoya-shi, JP 2 0
SHINKAI, Ibuki Nagoya-shi, JP 1 0
YAMAGUCHI, Masaru Nagoya-shi, JP 29 452

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