FILM CUTTING DEVICE, FILM CUTTING METHOD USING THE SAME, AND DISPLAY DEVICE INCLUDING CIRCUIT FILM CUT BY THE SAME

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United States of America

APP PUB NO 20220118637A1
SERIAL NO

17402872

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Abstract

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A film cutting device includes a stage which supports a circuit film, a cutter disposed on the stage to cut the circuit film, a vibration horn connected to the cutter, where the vibration horn vibrates the cutter in a first direction based on an ultrasonic wave, and a cooler which cools the cutter.

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Patent Owner(s)

Patent OwnerAddress
SAMSUNG DISPLAY CO LTD1 SAMSUNG-RO GIHEUNG-GU GYEONGGI-DO YONGIN-SI 17113

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Ban, Jeongmin Cheonan-si, KR 4 2
Joo, Soyeon Yongin-si, KR 11 9
Lee, Chung-Seok Hwaseong-si, KR 19 67
Lee, Joongmok Suwon-si, KR 6 2
Park, Hanho Yongin-si, KR 11 14
Park, Jeongeun Goyang-si, KR 7 23

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