Water-Based Anti-Corrosion Cutting Fluid for Electronic Device Housings
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United States of America
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Apr 21, 2022
app pub date -
May 9, 2019
filing date -
May 9, 2019
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Abstract
In one example, a method for manufacturing an electronic device housing is described. A coating layer may be formed on a surface of a metal substrate. Further, an edge region of the metal substrate may be chamfered by applying water-based anti-corrosion cutting fluid to form an exposed surface portion of the metal substrate. On the exposed surface portion, a transparent protective passivation layer may be formed. Furthermore, a first electrophoretic deposition layer may be formed on the transparent protective passivation layer.
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