ELECTRICAL COMPONENT HOUSING WITH COOLING CHANNELS
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United States of America
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Issued Date -
May 5, 2022
app pub date -
Oct 30, 2020
filing date -
Oct 30, 2020
priority date (Note) -
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Abstract
A housing for electrical components is provided with a substrate. Sidewalls extend from the substrate to define a cavity configured to receive electrical components. A cooling channel is formed integrally along and unitary with the substrate, spaced apart from the cavity, with a mating surface for at least one fluid cover. At least one fluid cover is mountable on the mating surface for at least one fluid cover to enclose the cooling channel and to redirect a fluid when present within the cooling channel.
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