BONDING AND SEALING MATERIAL, AND LID FOR OPTICAL DEVICE PACKAGE
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
N/A
Issued Date -
May 12, 2022
app pub date -
Nov 1, 2021
filing date -
Nov 1, 2021
priority date (Note) -
Published
status (Latency Note)
Importance
Abstract
A bonding and sealing material includes, as the essential ingredients, a solder powder, silver nanoparticles coated with a coating material and a solvent, and additionally includes at least one ingredient selected from the group consisting of selenium metal, oxide film inhibitors and oxide film removers. This bonding and sealing material can easily form under mild conditions a metallic adhesive layer having good hermetic sealability and UV resistance of the sort desired when sealing a short-wavelength light-emitting device such as a UV-LED, and can be stably used over a long period of time.
First Claim
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Advertisement
Advertisement
Advertisement
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully