SOLDERING IRON INCLUDING TEMPERATURE PROFILING AND METHOD OF USE
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United States of America Patent
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Issued Date -
Jul 21, 2022
app pub date -
Jan 15, 2021
filing date -
Jan 15, 2021
priority date (Note) -
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status (Latency Note)
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Abstract
A soldering iron with temperature profiling, comprising a hand piece or a robot arm including a soldering tip; a processor configured to provide temperature profiling where the soldering tip is one or more of the following during a soldering event: provided at multiple tip temperatures at fixed times during the soldering event; and provided at multiple tip temperatures at self-adjusting times during the soldering event.
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