PAPERBOARD STRUCTURES AND METHODS FOR MANUFACTURING PAPERBOARD STRUCTURES

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United States of America Patent

APP PUB NO 20220297335A1
SERIAL NO

17565005

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Abstract

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A method for manufacturing a paperboard structure configured to snap apart. The paperboard structure has a first surface and a second surface. The method includes defining first line along the first surface of the paperboard structure. The first line extends a first cut depth D1 through the paperboard structure. The method further includes cutting a second line along the second surface of the paperboard structure. The second line extends a second cut depth D2 through the paperboard structure. The second line is offset from the first line by a first offset distance DO1.

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Patent Owner(s)

Patent OwnerAddress
MULTI PACKAGING SOLUTIONS INC5800 WEST GRAND RIVER AVENUE LANSING MI 48906

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Dickman, Mathew D Plainfield, US 1 0
Knight, Christopher B Plainsfield, US 1 0

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