Importance

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Abstract

A high-power resistor includes a substrate, a resistor layer, two edge electrodes, and a seed layer. The substrate has a first surface. The resistor layer is mounted on the first surface of the substrate. The two edge electrodes are mounted on the resistor layer. The seed layer is mounted between the resistor layer and the two edge electrodes. A contacting surface between one of the two edge electrodes and the resistor layer is bigger than contacting side surfaces of a printed resistor layer and printed conduction layers from a conventional chip resistor, creating less electrical resistance. When high-power electricity passes through the resistor layer, heat generated by a large passing current can be equally dissipated in all directions on the contact surface. With less electrical resistance and better heat dissipation, the contacting surface enables the high-power resistor to tolerate greater electric power.

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First Claim